SCANNING MICROSPOT AUGER-SPECTROSCOPY STUDY OF INTERDIFFUSION AND EUTECTIC FORMATION IN W-PT-W-AU THIN-FILMS

被引：5

作者：

CHRISTOU, A ^{[1
]}

DAY, HM ^{[1
]}

机构：

[1] USN,RES LAB,WASHINGTON,DC 20375

来源：

IEEE TRANSACTIONS ON PARTS HYBRIDS AND PACKAGING | 1975年 / 11卷 / 03期

关键词：

D O I：

10.1109/TPHP.1975.1135060

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：229 / 235

页数：7

共 21 条

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[7] SEM, AUGER-SPECTROSCOPY AND ION BACKSCATTERING TECHNIQUES APPLIED TO ANALYSES OF AU-REFRACTORY METALLIZATIONS [J].

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[8]

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[9]

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[10] CORROSION RESISTANCE OF SEVERAL INTEGRATED-CIRCUIT METALLIZATION SYSTEMS [J].

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