共 11 条
[1]
[Anonymous], SMART ENERGY DISTRIB
[2]
Development of compact thermal models for advanced electronic packaging: Methodology and experimental validation for a single-chip CPGA package
[J].
ITHERM 2000: SEVENTH INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS, VOL I, PROCEEDINGS,
2000,
:225-232
[3]
A time-domain method for the analysis of thermal impedance response preserving the convolution form
[J].
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES,
1999, 22 (02)
:238-244
[4]
DIRECTOR SW, 1975, CIRCUIT THEORY COMPU
[5]
Kreider J. F., 2000, Handbook of Heating, Ventilation, and Air Conditioning
[6]
LEY BJ, 1959, LINEAR CIRCUIT ANAL, P12
[7]
Ljung L., 1991, System Identification: Theory for the User
[8]
Ljung L., 1999, SYSTEM IDENTIFICATIO
[9]
Rencz M, 2000, 2000 INTERNATIONAL CONFERENCE ON MODELING AND SIMULATION OF MICROSYSTEMS, TECHNICAL PROCEEDINGS, P209
[10]
SO ATP, 2001, PERSPECTIVES CONTROL, P393