Challenges and innovations in very-large CCD and CMOS imagers for professional imaging

被引：1

作者：

Bosiers, Jari T. ^{[1
]}

Stold, Holger ^{[1
]}

Klaassens, Wilco ^{[1
]}

Dillen, Bart ^{[1
]}

Peters, Inge ^{[1
]}

Bogaart, Erik ^{[1
]}

Frost, Raymond ^{[2
]}

Korthout, Laurens ^{[1
]}

Timpert, Jurgen ^{[1
]}

机构：

[1] DALSA Profess Imaging, High Tech Campus 23, NL-5656 AE Eindhoven, Netherlands

[2] DALSA Semicond, Bromont, PQ, Canada

来源：

SILICON PHOTONICS AND PHOTONIC INTEGRATED CIRCUITS | 2008年 / 6996卷

关键词：

CCD; CMOS; imager; stitching; digital still camera; medical imaging; X-ray imaging;

D O I：

10.1117/12.785847

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

This paper presents an overview of the specific challenges that need to be overcome to make very-large CCD and CMOS imagers, and presents some recent innovations in this area. The complete development chain is described: research, production and industrialization. It will be shown that by innovative design and technology concepts, high-quality very-large area CCD and CMOS imagers can be made, even up to wafer size (6" for CCD, 8" for CMOS).

引用

页数：14