Modeling of curing process and residual stress analysis of thick-section thermosetting composites厚截面热固性复合材料固化过程建模及残余应力分析

被引：1

作者：

机构：

[1] Beijing Institute of Technology,Institute of Advanced Structure Technology

[2] China Helicopter Research and Development Institute,School of Aerospace Engineering

[3] Beijing Institute of Technology,State Key Laboratory of Explosion Science and Technology

[4] Beijing Institute of Technology,undefined

来源：

Acta Mechanica Sinica | 2026年 / 42卷 / 1期

关键词：

Curing Behavior; Thick-section composite; Residual stress field;

D O I：

10.1007/s10409-024-24411-x

中图分类号：

学科分类号：

摘要：

The curing behavior of composites significantly influences their performance, making it crucial to understand the curing process. This study experimentally measured specific heat capacity, thermal conductivity, glass transition temperature, coefficient of thermal expansion, and cure shrinkage of materials. A simulation model of its curing deformation was established and validated against strain data obtained from fiber Bragg grating experiments. The effects of thickness, heating rate, and cooling rate on the curing temperature field and residual stress field during the molding of thick-section composite plates were analyzed.

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